At AI Infra Summit 2026, Synopsys' Thomas Andersen joins Brendan Burke and Matt Kimball to explain how chip design is moving from AI copilots that suggest to agentic systems that execute tool orchestration, timing fixes, and verification from a written spec. For enterprises, that shift compresses spec-to-tapeout timelines and lowers the resource barrier to custom silicon.

Physical AI is shifting from lab prototypes to fleets of machines operating reliably in the real world, and Ambarella's Muneyb Minhazuddin joins Six Five On The Road at AI Infra 2026 to explain what that shift demands of silicon, memory and developer workflows. Minhazuddin traces the case back to a 22-year-old chip architecture and forward to a developer cloud built to compress model porting time from months to days, and he identifies enterprise ROI proof points as the biggest hurdle left before physical AI scales into millions of deployed units.

AI infrastructure is running into a physical wall, and Samsung's answer is architectural. At FMS 2026, Samsung Semiconductor's Donovan Hwang and Eyal Pnini join Six Five to unveil zHBM and V10-BV, concept architectures designed to close the physical distance between memory and logic and keep pace with AI's growing demands.