At OCP Global Summit 2026, MiTAC Computing's Raymond Huang explains why AI infrastructure has become a full-stack integration problem spanning compute density, cooling, firmware, and deployment speed. For data center operators, advanced cooling and open management are now as decisive to scaling AI as GPU selection.

MiTAC Computing is addressing the core constraints of enterprise AI scaling: floor space, power capacity, and cooling efficiency. Matt Kimball catches up with Raymond Huang at Computex 2026 to walk through a full portfolio spanning high-density liquid-cooled racks, diamond-cooled air servers, unified POD management, and containerized modular AI factories that cut deployment timelines from years to weeks.

As AI moves into production, infrastructure flexibility, orchestration, and data performance are becoming critical. MiTAC outlines how modular platforms and integrated partnerships are enabling scalable, high-performance AI deployments.